Challenge #3 (Wafer.Space GF180MCU) is currently accepting proposals, due August 31, 2026. See the Challenge #3 page and its Rules & Regulations before you write yours. Challenge #2 (IHP SG13CMOS5L)'s proposal field is now closed; see Challenge #2 for its status.

Steps to get involved

1

Follow the forum

Keep up with announcements and discussion at fossi-chat.org/#chipalooza. All changes to challenge terms are posted there first.

2

Let us know you're interested

Fill out the short interest survey below so we know who's planning to participate.

3

Send in your proposal

Email your written proposal to Open Circuit Design by the posted due date. See requirements below.

Submit your proposal

Proposals go to:

chipalooza@opencircuitdesign.com

Your proposal document should include:

Sent as separate attachments (not part of the main proposal document):

Leave personal and institutional details out of the main proposal document. It will ultimately become part of the IP block's public documentation. Full details in each challenge's own Rules & Regulations page (see Challenge #3, currently accepting proposals).

Take the survey

Let us know you're interested in participating, even if your proposal isn't ready yet: